Technical Approach
HySPRINT Technical Approach Overview
Integrated manufacturing concept
HySPRINT aims to optimise the manufacturing of solid oxide electrolysis cells (SOECs), increasing production efficiency, reducing waste, and lowering capital and operating costs, while delivering improved product quality and durability. Rather than focusing on a single component, HySPRINT takes a systemic approach covering the entire SOEC manufacturing chain. The steam electrode and electrolyte will be produced using the innovative ReScale method, followed by the deposition of a high-quality, ultra-thin barrier layer through PVD magnetron sputtering. The oxygen electrode will then be applied using inkjet printing. In addition to the inherent benefits of these advanced techniques, production will be monitored by an AI-driven quality control system (AEMS), enabling early detection of manufacturing defects and further reducing scrap rates. At the same time, the concept integrates eco-design, design-for-recycling, and critical raw material recovery strategies to enhance the sustainability and circularity of SOEC production. By the end of the project, the complete manufacturing workflow will be validated at MRL 5 and TRL 6 through the production and testing of a 5 kW SOEC stack in a relevant industrial environment.
Key Manufacturing Technologies
InkJet Printing
Oxygen Electrode & Thin Films
- What it does? InkJet printing deposits ink droplets between 5 and 50 pl by means of a piezoelectric actuator working on computer to table concept, following as specific design.
- Why it's chosen? HySPRINT implements a oxygen electrode printing for accurate thickness, reduced cost, increased speed 30-45 m2/h and tight layer density control.
- Key advantage: Ink jet printing allows precise control of layer thickness, accurate control of thickness between 5 and 40 microns and rapid ink or substrate changes. As a non-contact process, it can print on rough or patterned surfaces while reducing ink consumption. Ink jet technology follows an environmental friendly path.
PVD Magnetron Sputtering
Barrier Layer
- What it does? Magnetron sputtering can deposit thin-films of barrier layer materials with excellent quality.
- Why it’s chosen? It has been demonstrated that high-quality PVD deposited layers can lead to a significant improvement of the cells performance.
- Key Advantage: PVD barrier layers provide cells with lower overpotentials and capable to provide higher power densities.
ReScale Method
Steam Electrode & Electrolyte
- What it does? ReScale introduces a controlled corrugation of the ceramic component prior to sintering, by deliberately exploiting the large sintering shrinkage, the corrugated structure collapses during sintering and eliminates common sintering failure mechanisms.
- Why it’s chosen? To increase sintering yield to 95% and minimise scraps.
- Key Advantage: ReScale improves manufacturing yield and reduces the need for post-processing